Sony and Taiwan Semiconductor Manufacturing Co are preparing a roughly $6.3bn joint venture in Japan to develop and manufacture advanced image sensors, marking a significant expansion of Sony’s semiconductor investment and deepening its manufacturing ties with the world’s largest contract chipmaker.
The venture would establish development and production lines at Sony’s new fabrication facility in Koshi, Kumamoto Prefecture, under a memorandum of understanding announced by the companies in May.
Nikkei reported that Sony would hold about 60 per cent of the venture and TSMC around 40 per cent, with commercial production potentially beginning as early as 2029.
The project is expected to target applications beyond smartphones, including automotive systems, robotics and physical AI, combining Sony’s established position in image sensors with TSMC’s advanced process technology and foundry manufacturing capabilities.
The reported ¥1tn investment, ownership structure and production timetable have not yet been formally confirmed by either company. The partners have said spending would be phased according to market demand and partly depend on Japanese government support.
The venture would give Sony closer access to advanced semiconductor manufacturing technology as competition intensifies for sensors used in vehicles, robotics and AI-enabled devices, while adding another large-scale investment to Japan’s broader effort to rebuild domestic chipmaking capacity.
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